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dc.contributor.authorVelázquez Pérez, Jesús Enrique 
dc.contributor.authorMeziani, Yahya Moubarak 
dc.contributor.authorSánchez Hernández, Esteban 
dc.contributor.authorMoreno Vázquez, María 
dc.contributor.authorCalvo Gallego, Jaime 
dc.contributor.authorAbidi, EL Hadj
dc.contributor.authorRangel García, Julio
dc.coverage.temporalstart 2024-6-01 end 2025-12-31es_ES
dc.date.accessioned2026-03-19T08:00:14Z
dc.date.available2026-03-19T08:00:14Z
dc.date.issued2026
dc.identifier.citationVelázquez-Pérez, J. E., Meziani, Y. M., Sánchez Hernández, E., Moreno Vázquez, M., Calvo Gallego, J., Abidi, E. L. H., & Rangel García, J. (2026). PDC2023-145856-I00_Dataset [Data set]. Universidad de Salamanca. https://doi.org/10.71636/QK8P-YZ94
dc.identifier.urihttp://hdl.handle.net/10366/170651
dc.descriptionTítulo del Proyecto PROTOTIPO DE DETECTOR AVANZADO EN LA BANDA DE TERAHERCIOS PARA APLICACIONES DE SEGURIDAD E IMAGENESes_ES
dc.description.abstract[ENG]The terahertz (THz) spectral range lies between the microwave and infrared regions of the electromagnetic spectrum, generally referring to the range between 0.1 and 10 THz. THz technology is of great interest due to its specific properties. Many materials, such as paper and plastic, are transparent to this radiation, enabling inspection and security operations. Many substances have a 'fingerprint' (a characteristic spectrum) in the THz range, making THz radiation a powerful tool for spectroscopic applications. Due to its low photon energy (approximately one million times lower than X-rays), THz radiation is non-ionising and therefore poses no danger to humans. This research project aimed to develop, demonstrate and prepare for transfer a new THz detector prototype capable of competing effectively with existing technologies. The new system was designed modularly so that sensor chips manufactured using different technologies can be employed. In particular, the project has employed two cutting-edge technologies: silicon FinFET transistors and graphene-based transistors. The detection process uses two transistors and is based on plasmon oscillation in a two-dimensional electronic system within an FET channel. This enables EM radiation in the terahertz range to be detected, in accordance with the Dyakonov–Shur theory. These sensors offer several advantages: low cost; a faster response time than other detectors (e.g. bolometers and pyroelectrics); operation at room temperature; scalability; integration into CMOS silicon technology for FinFETs; and compatibility with graphene-based transistors. Graphene field-effect transistors (GFETs), which were developed at the USAL, are highly attractive for THz applications thanks to their high channel mobility (over 100,000 cm²/Vs at room temperature) and efficient light-matter interaction. GFETs have been fabricated with various types of integrated antenna to improve responsivity. FinFETs constitute the latest generation of commercial transistors with ultra-short gate topology, making them excellent candidates for building THz detectors that are almost ready for the market, with the potential for integration of read-out circuitry. The devices were measured in the 0.15–5 THz range and between 4 and 300 K. In particular, the figures of merit, responsivity and NEP (noise equivalent power), were determined.es_ES
dc.description.sponsorshipThese results were obtained as part of a project funded by the Programme Proyectos I+D+i Pruebas de Concepto del Ministerio de Ciencia, Investigación y Universidades/AEI (2023 call)es_ES
dc.description.tableofcontentsThis dataset is divided into 5 different .zip files: 1. The folder Prototipo_Image.zip contains the files: Prototipo02.jpg Prototipo_01.jpg 2. The folder Graphene_Sensor.zip contains the files: Graphene-ONOFF-THz.png GrapheneFET-IDVG-CNP-8K GrapheneFET-IDVG-CNP-300K.txt DU_4p7THz_260Hz at VBG=CNP_VTG1=VTG2=m1to1-0.20000 3. The folder FinFET_Sensor.zip contains the files: FINFETs I D2_PVvsVg_404GHz_20d_0uA.txt FINFETs I D2_PVvsVg_250GHz_70d_0uA.txt FINFETs I D2_PVvsVg_210GHz_200d_0uA.txt FINFETs-Response_vs_Vg.pdf FINFET-IdVd-V0p6V.txt FINFET-IdVd-V0p3V.txt FINFET-IdVd.pdf 4. The folder USAL_Images.zip contains the files: USAL-image-300GHz.png ChipTHzImage.png 5. The folder PCB-proyecto.zip c contains the files: TERALAB USAL (V3.3).pdsprj TERALAB USAL (V3.3) - CADCAM.ZIP que contiene TERALAB USAL (V3.3) - CADCAM Top Copper.GBR TERALAB USAL (V3.3) - CADCAM Bottom Copper.GBR TERALAB USAL (V3.3) - CADCAM Top Silk Screen.GBR TERALAB USAL (V3.3) - CADCAM Top Solder Resist.GBR TERALAB USAL (V3.3) - CADCAM Bottom Solder Resist.GBR TERALAB USAL (V3.3) - CADCAM Top SMT Paste.GBR TERALAB USAL (V3.3) - CADCAM Mechanical 1.GBR TERALAB USAL (V3.3) - CADCAM Top Assembly.GBR TERALAB USAL (V3.3) - CADCAM Drill TOP-BOT Plated.GBR TERALAB USAL (V3.3) - CADCAM Netlist.IPC TERALAB USAL (V3.3) - CADCAM READ-ME.TXTes_ES
dc.language.isoenges_ES
dc.publisherUniversidad de Salamancaes_ES
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 Internacionales_ES
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/es_ES
dc.subjectNanotechnologyes_ES
dc.subjectSilicones_ES
dc.subjectTerahertzes_ES
dc.subjectPrototypeses_ES
dc.subject2D materialses_ES
dc.subjectFETes_ES
dc.subjectPlasma waveses_ES
dc.subjectSensores_ES
dc.subjectPlasmonicses_ES
dc.titlePDC2023-145856-I00_Datasetes_ES
dc.typeinfo:eu-repo/semantics/datasetes_ES
dc.subject.unesco33 Ciencias Tecnológicases_ES
dc.subject.unesco3312 Tecnología de Materialeses_ES
dc.identifier.doi10.71636/qk8p-yz94
dc.relation.projectIDPDC2023-145856-I00es_ES
dc.rights.accessRightsinfo:eu-repo/semantics/openAccesses_ES
dc.type.hasVersioninfo:eu-repo/semantics/draftes_ES
dc.publication.year2026


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