Compartir
Título
PDC2023-145856-I00_Dataset
Autor(es)
Palabras clave
Nanotechnology
Silicon
Terahertz
Prototypes
2D materials
FET
Plasma waves
Sensor
Plasmonics
Clasificación UNESCO
33 Ciencias Tecnológicas
3312 Tecnología de Materiales
Fecha de publicación
2026
Editor
Universidad de Salamanca
Citación
Velázquez-Pérez, J. E., Meziani, Y. M., Sánchez Hernández, E., Moreno Vázquez, M., Calvo Gallego, J., Abidi, E. L. H., & Rangel García, J. (2026). PDC2023-145856-I00_Dataset [Data set]. Universidad de Salamanca. https://doi.org/10.71636/QK8P-YZ94
Resumen
[ENG]The terahertz (THz) spectral range lies between the microwave and infrared regions of the electromagnetic spectrum, generally referring to the range between 0.1 and 10 THz. THz technology is of great interest due to its specific properties. Many materials, such as paper and plastic, are transparent to this radiation, enabling inspection and security operations. Many substances have a 'fingerprint' (a characteristic spectrum) in the THz range, making THz radiation a powerful tool for spectroscopic applications. Due to its low photon energy (approximately one million times lower than X-rays), THz radiation is non-ionising and therefore poses no danger to humans.
This research project aimed to develop, demonstrate and prepare for transfer a new THz detector prototype capable of competing effectively with existing technologies. The new system was designed modularly so that sensor chips manufactured using different technologies can be employed. In particular, the project has employed two cutting-edge technologies: silicon FinFET transistors and graphene-based transistors.
The detection process uses two transistors and is based on plasmon oscillation in a two-dimensional electronic system within an FET channel. This enables EM radiation in the terahertz range to be detected, in accordance with the Dyakonov–Shur theory.
These sensors offer several advantages: low cost; a faster response time than other detectors (e.g. bolometers and pyroelectrics); operation at room temperature; scalability; integration into CMOS silicon technology for FinFETs; and compatibility with graphene-based transistors.
Graphene field-effect transistors (GFETs), which were developed at the USAL, are highly attractive for THz applications thanks to their high channel mobility (over 100,000 cm²/Vs at room temperature) and efficient light-matter interaction. GFETs have been fabricated with various types of integrated antenna to improve responsivity.
FinFETs constitute the latest generation of commercial transistors with ultra-short gate topology, making them excellent candidates for building THz detectors that are almost ready for the market, with the potential for integration of read-out circuitry.
The devices were measured in the 0.15–5 THz range and between 4 and 300 K. In particular, the figures of merit, responsivity and NEP (noise equivalent power), were determined.
Descripción
Título del Proyecto PROTOTIPO DE DETECTOR AVANZADO EN LA BANDA DE TERAHERCIOS PARA APLICACIONES DE SEGURIDAD E IMAGENES
URI
DOI
10.71636/qk8p-yz94
Tabla de contenidos
This dataset is divided into 5 different .zip files:
1. The folder Prototipo_Image.zip contains the files:
Prototipo02.jpg
Prototipo_01.jpg
2. The folder Graphene_Sensor.zip contains the files:
Graphene-ONOFF-THz.png
GrapheneFET-IDVG-CNP-8K
GrapheneFET-IDVG-CNP-300K.txt
DU_4p7THz_260Hz at VBG=CNP_VTG1=VTG2=m1to1-0.20000
3. The folder FinFET_Sensor.zip contains the files:
FINFETs I D2_PVvsVg_404GHz_20d_0uA.txt
FINFETs I D2_PVvsVg_250GHz_70d_0uA.txt
FINFETs I D2_PVvsVg_210GHz_200d_0uA.txt
FINFETs-Response_vs_Vg.pdf
FINFET-IdVd-V0p6V.txt
FINFET-IdVd-V0p3V.txt
FINFET-IdVd.pdf
4. The folder USAL_Images.zip contains the files:
USAL-image-300GHz.png
ChipTHzImage.png
5. The folder PCB-proyecto.zip c contains the files:
TERALAB USAL (V3.3).pdsprj
TERALAB USAL (V3.3) - CADCAM.ZIP que contiene
TERALAB USAL (V3.3) - CADCAM Top Copper.GBR
TERALAB USAL (V3.3) - CADCAM Bottom Copper.GBR
TERALAB USAL (V3.3) - CADCAM Top Silk Screen.GBR
TERALAB USAL (V3.3) - CADCAM Top Solder Resist.GBR
TERALAB USAL (V3.3) - CADCAM Bottom Solder Resist.GBR
TERALAB USAL (V3.3) - CADCAM Top SMT Paste.GBR
TERALAB USAL (V3.3) - CADCAM Mechanical 1.GBR
TERALAB USAL (V3.3) - CADCAM Top Assembly.GBR
TERALAB USAL (V3.3) - CADCAM Drill TOP-BOT Plated.GBR
TERALAB USAL (V3.3) - CADCAM Netlist.IPC
TERALAB USAL (V3.3) - CADCAM READ-ME.TXT
Aparece en las colecciones
Ficheros en el ítem
Nombre:
Tamaño:
269.5Kb
Formato:
Desconocido
Descripción:
File .zip that gathers measurements on the GET (.txt files) and one graphics
Nombre:
Tamaño:
124.9Kb
Formato:
Desconocido
Descripción:
File .zip that gathers measurements on the FinFETs (.txt files) and two graphics (.pdf)
Nombre:
Tamaño:
1019.Kb
Formato:
Desconocido
Descripción:
Two graphics' files on measurements performed in the USAL TeraLab
Nombre:
Tamaño:
4.410Mb
Formato:
Desconocido
Descripción:
File .zip that contains two snapshots of the fabricated prototype
Nombre:
Tamaño:
115.8Kb
Formato:
Desconocido
Descripción:
Files of the PCBs of the prototype: files Gerber (.GBD) and one single file (.PDSPRJ) that contains the Proteus Design Suite of the Proteus project
Nombre:
Tamaño:
6.420Kb
Formato:
Desconocido
Descripción:
Fichero explicativo












